Description:
Covers and protects the AP board from dust and damage.
Features:
Electronic Component Protection: Shields the sensitive Application Processor (AP) board from environmental factors like dust, moisture, and debris.
Mechanical Safety: Prevents accidental contact between internal moving parts and the electronic components of the AP board.
Optimized for Ventilation: Designed with precise openings or features to allow heat generated by the processor to dissipate effectively, preventing overheating.
OEM Replacement: Official Bambu Lab component, guaranteeing the correct mounting points, material composition, and physical dimensions for perfect fit within the H2D chassis.
Durable Construction: Made from high-quality, non-conductive polymer suitable for the machine's internal environment.
Specifications:
Compatibility: H2 Series
Materials: Plastic
Color: Black
In the Box
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AP Board Cover*1
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Cable Tray Cover*1
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BT2.6-8 Screw*1
